Industrial Infrastructure

Adhesive Solutions for Industrial & Infrastructure Electronics

Dymax light-curable materials help overcome design and assembly challenges in industrial and infrastructure electronics, including appliances, power tools, speakers, and data center edge servers. These one-component adhesives, coatings, encapsulants, gaskets, and structural bonders cure rapidly with light—providing precise bonding, structural reinforcement, and long-term protection for PCBs and other critical components.

Challenges and Solutions

Thermal Management: Materials help dissipate heat and protect electronics in high-temperature environments.
Component Stability: Adhesives and gaskets reinforce assemblies, minimize movement, and resist thermal and mechanical stress.
Environmental Protection: Encapsulants and coatings shield components against moisture, dust, and temperature cycling.

Caractéristiques

Cures in seconds with UV/LED/Visible light for high-throughput production
Dual-cure options with heat or moisture for shadowed areas not reachable by light
Instant fixture and on-demand cure reduce work-in-process
One-part materials require no mixing, simplifying handling and reducing waste
Thixotropic, high-viscosity materials enable accurate, controlled dispensing
Low-movement adhesives support precise bonding and dimensional stability
Fluorescing products enable high-speed visual inspection and quality control
No-solvents-added materials align with sustainability and workplace safety goals

Catégories

Assemblage de produits électroménagers

Dymax propose des adhésifs, revêtements, joints et matériaux masquants adhésifs polymérisables à la lumière UV/visible pour les appareils électroménagers de grande et petite taille, les outils électriques et les sous-composants. Les pièces peuvent être traitées immédiatement après polymérisation, ce qui accélère la production, augmente le rendement et réduit les coûts d'exploitation.

Dymax light-cure solutions for edge server electronics assembly.

Edge Server Assembly

Enable efficient heat transfer and protect components in edge computing servers from exposure to challenging environmental conditions, movement, and stress with ight-curable encapsulants and adhesives.

Assemblage de haut-parleur

Adhésifs polymérisables et joints photopolymérisables pour l'assemblage d'aimants, de cônes, de membranes et de bobines acoustiques de haut-parleurs.

Ressources

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